Dr.-Ing. Pierre Mayr

  • Akademische/r Rätin/Rat - Lehrstuhl Integrierte Systeme
Mayr, Pierre
Raum
ID 1/445
Telefon:
(+49)(0)234 / 32 - 29351
E-Mail:
pierre.mayr@ruhr-uni-bochum.de

Lehrveranstaltungen

Veröffentlichungen

2016
A 200 um by 100 um Smart Dust System with an Average Current Consumption of 1.3 nA

Dominic Funke, Pierre Mayr, Lukas Straczek, John S. McCaskill, Jürgen Oehm, Nils Pohl - 23rd IEEE International Conference on Electronics, Circuits and Systems (ICECS), Monte Carlo, Monaco, Dec 11-14 2016

Ultra low-power, -area and -frequency CMOS thyristor based oscillator for autonomous microsystems

Dominic Funke, Pierre Mayr, Thomas Maeke, John S. McCaskill, Abhishek Sharma, Lukas Straczek, Jürgen Oehm - Journal Analog Integrated Circuits and Signal Processing, 2016, DOI 10.1007/s10470-016-0799-9

Microarray of programmable electrochemically active elements.

John S. McCaskill, Thomas Maeke, Lukas Straczek, Jürgen Oehm, Dominic Funke, Pierre Mayr, Abhishek Sharma, Asbjørn Müller, Uwe Tangen, Norman H. Packard, Steen Rasmussen - Proceedings of the Artificial Life Conference 2016 - Cancun, Mexico. MIT Press. 2016. p. 78-79.

2015
Ultra low-power, -area and -frequency CMOS thyristor based oscillator for autonomous microsystems

Dominic Funke, Jürgen Oehm, Pierre Mayr, Thomas Maeke, John S. McCaskill, Abhishek Sharma, Lukas Straczek - Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC), 2015

2012
Microscale Chemically Reactive Electronic Agents

John S. McCaskill, Günter von Kiedrowski, Jürgen Oehm, Pierre Mayr, Lee Cronin, Itamar Willner, Andreas Herrmann, Steen Rasmussen, Frantisek Stepanek, Norman H. Packard, Peter R. Wills

2011
On the Design of Millimeter Wave Integrated Circuits in Modern CMOS-Technologies

Pierre Mayr - Ger­man-Chi­ne­se Young Sci­en­tists Forum “Elec­tro­nics and Micro­wa­ve En­gi­nee­ring”, Shang­hai, China

2009
On the Design of Millimeter Wave Integrated Circuits in Modern CMOS-Technologies

Pierre Mayr, Christopher Weyers, Johannes Kunze, Ulrich Langmann - International Symposium on Microwave and Optical Technology, pp 963-966, New Delhi, India, Dec 16-19, 2009

60 GHz WPAN - Analoge Schaltungskomponenten in 65-nm-CMOS-Technologie für den Empfangspfad drahtloser Datenübertragungssysteme im Gigabit-Bereich

Johannes Kunze, Pierre Mayr, Christopher Weyers, Ulrich Langmann - Radio Techniques and Technologies for Commercial Communication and Sensing Applications, Berlin, 18. - 19. November 2009

60 GHz compact low noise amplifier in 65 nm CMOS

Johannes Kunze, Christopher Weyers, Pierre Mayr, Attila Bilgic, Josef Hausner - Institution of Engineering and Technology, Electronics Letters, Vol: 45, No: 20, pp.1035, September 24, 2009

2008
Improved RF-Performance of Sub-Micron CMOS Transistors by Asymmetrically Fingered Device Layout

Christopher Weyers, Daniel Kehrer, Johannes Kunze, Pierre Mayr, Domagoj Siprak, Marc Tiebout, Josef Hausner, Ulrich Langmann - IEEE Radio Frequency Integrated Circuits Symposium 2008, Atlanta, Georgia, 15-17 June, 2008

Ingenieure entwerfen integrierte Schaltungen für Funkkommunikation im Gigabit-pro-Sekunde-Bereich und mehr Sicherheit im Straßenverkehr

Ulrich Langmann, Pierre Mayr, Christopher Weyers - RUBIN Wissenschaftsmagazin der Ruhr-Universität Bochum, Frühjahr 2008

A 22.3dB-Voltage-Gain 6.1dB-NF 60GHz LNA in 65nm CMOS with Differential Output

Christopher Weyers, Pierre Mayr, Johannes Kunze, Ulrich Langmann - 2008 IEEE International Solid-State Circuits Conference, San Francisco, Feb 2008

2007
Entwurf von Hochfrequenzschaltungen in 65 nm CMOS

Pierre Mayr, Christopher Weyers, Ulrich Langmann, Josef Hausner - EEEfCOM 2007, Ulm, Juni 2007

A 90GHz 65nm CMOS Injection-Locked Frequency Divider

Pierre Mayr, Christopher Weyers, Ulrich Langmann - 2007 IEEE International Solid-State Circuits Conference, Feb. 2007, San Francisco, Dig. Tech. Papers, pp. 198-199

2006
13 GHz Divide-by-Four Cascaded CMOS Injection Locked Frequency Divider

Pierre Mayr, T. Mronga, M. Tiebout, Ch. Kienmayer, R. Thueringer, Ulrich Langmann - Asia-Pacific Microwave Conference 2006, Dec. 2006, Conf. Proceedings pp. 520-523

A 17-GHz 130-nm CMOS VCO Subsystem Module in LTCC-Based Technology for WLAN Applications

Pierre Mayr, S. Mecking, S. Walter, R. Matz, Ulrich Langmann - International Journal of RF and Microwave Computer-Aided Engineering, Vol. 16, No 3, pp. 218-226

2005
Keramische System-in-Package-Technologie für 5-GHz-WLAN-Transceiver

R. Matz, W. Bakalski, W. Debski, Ulrich Langmann, Pierre Mayr, W. Simbürger, S. Walter, P. Weger, Christopher Weyers - Deutsche IMAPS-Konferenz, München, 10.-11. Oktober 2005

2004
Wireless RF Multi-Chip-Modules for LTCC System-in-Package Solutions: Key Design Considerations

Ulrich Langmann, Pierre Mayr, S. Mecking - Asia Pacific Microwave Conference,15-18 December 2004, New Delhi, Indien, Invited Paper

Multilayer Ceramic Band-Pass-Filters for System-in-Package 5-GHz-WLAN Transeivers

W. Debski, S. Walter, R. Matz, O. Dernovsek, S. Mecking, Pierre Mayr, P. Weger - 37th International Symposium on Microelectronics (IMAPS 2004), 14-18 November 2004, Long Beach, FL